產品內容
Product name:CK300 FOUP 前開式晶圓傳輸盒
Dimension:(L)40 x (W)34.8 x (H)33.9 cm
Weight:5000g
Capacity:25 PCS
Wafer size:300mm(12 inch)Wafer
Material:Customized
Slot pitch:10 mm
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300mm FOUP 前開式晶圓傳送盒/ 晶圓傳輸盒,可保護、運送、並儲存300mm晶圓,在運輸傳載及儲存時提供安全防護。有效降低晶圓受到微塵汙染的風險,避免晶圓受靜電損害,進而促進良率。支援AMHS功能,尺寸符合SEMI規範,並提供高潔淨度之晶圓承載與自動化解決方案。
依製程需求,可選擇常溫版(ST)或可進烘烤的高溫版本(HT)
耐高溫FOUP可達到製程整合,並可選擇可使用薄化晶圓的型號
專利字號:
台灣專利字號第M528296、I549881、 I586597、M563421號
中國大陸專利字號第CN205609490U、CN204348693U、 CN206259327U、CN208007736U號
韓國專利字號第20-0486265號
300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate.
CKplas CK300/CK313 FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, CK300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.
Patent No.:
Taiwanese Patent No.:M528296、I549881、 I586597、M563421
Chinese Patent No.:CN205609490U、CN204348693U、 CN206259327U、CN208007736U
Korea Patent No.:20-0486265
公司資訊
- 統一編號22907106
- 聯絡人沈小姐
- 更多中勤實業股份有限公司資訊
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