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產品內容
| P/N: | MCP607-I/P |
| Category | Integrated Circuits (ICs) |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
| Series | - |
| Amplifier Type | General Purpose |
| Number of Circuits | 2 |
| Output Type | Rail-to-Rail |
| Slew Rate | 0.08 V/µs |
| Gain Bandwidth Product | 155kHz |
| -3db Bandwidth | - |
| Current - Input Bias | 1pA |
| Voltage - Input Offset | 250µV |
| Current - Supply | 18.7µA |
| Current - Output / Channel | 17mA |
| Voltage - Supply, Single/Dual (±) | 2.5 V ~ 6 V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300", 7.62mm) |
| Supplier Device Package | 8-PDIP |
| If you have need the stock,please don't hesitate to contact with Trustbond Technology Corp. | |
| Http://www.trustbond.com.tw | |
公司資訊
- 統一編號29025439
- 聯絡人潘小姐
- 更多美福科技股份有限公司資訊
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巨汯工程電子專利公告本裝置具有低成本及高難度破解之優點，亦可做為各種用途，本裝置亦有環保之概念，可簡
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