Wafer Bonder

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產品內容

Description: AST Samurai Wafer Bonding System provides the complete product line covering the production scale from volume production, pilot production to RD platform for wafer level bonding application. Samurai Wafer Bonding System has served Industry Application of worldwide customers from LED, Compound Semiconductor, MEMS, BioChip, Advanced Packaging, and EMI Device. 1) Metal (Eutectic) Bonding 2) Adhesive (Glue, Expoxy) 3) Anodic Bonding 4) Thermal Direct Bonding 5) Alignment Bonding 6) Advanced Packaging Bonding 7) 3D Packaging Bonding Features: Samurai series has system configuration for Eutectic, Adhesive, Anodic bonding, with independent temperature, precise bonding pressure, voltage control and alignment mechanism design suitable for different customer application. Specification: Standard Vacuum Model handling wafer size from 2"~8" available. Please contact AST for your application. Safety Approval: TUV Country of Origin: Taiwan Main Export Markets: Worldwide工業接著劑
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公司資訊

  1. 統一編號80071060
  2. 聯絡人翁慶毅
  3. 更多AST聚昌科技有限公司資訊
網頁更新日:
https://www.seoweb66.com/web/QA?postID=948278外六方钛螺栓

宝鸡市铭海钛业有限公司 外六方钛螺丝,内六方钛螺丝,六方螺母,垫片,等钛标准件,钛异形件,钛紧固件

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