Wafer Bonder

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產品內容

Description: AST Samurai Wafer Bonding System provides the complete product line covering the production scale from volume production, pilot production to RD platform for wafer level bonding application. Samurai Wafer Bonding System has served Industry Application of worldwide customers from LED, Compound Semiconductor, MEMS, BioChip, Advanced Packaging, and EMI Device. 1) Metal (Eutectic) Bonding 2) Adhesive (Glue, Expoxy) 3) Anodic Bonding 4) Thermal Direct Bonding 5) Alignment Bonding 6) Advanced Packaging Bonding 7) 3D Packaging Bonding Features: Samurai series has system configuration for Eutectic, Adhesive, Anodic bonding, with independent temperature, precise bonding pressure, voltage control and alignment mechanism design suitable for different customer application. Specification: Standard Vacuum Model handling wafer size from 2"~8" available. Please contact AST for your application. Safety Approval: TUV Country of Origin: Taiwan Main Export Markets: Worldwide瓦斯器材
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公司資訊

  1. 統一編號80071060
  2. 聯絡人翁慶毅
  3. 更多AST聚昌科技有限公司資訊
網頁更新日:
https://www.seoweb66.com/web/QA?postID=292839KMC-4400R監控卡

1.可接1至16隻攝像機;彩色或黑白均可 2.ENGINE-K壓縮格式,支持PAL以及NTSC製式

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